- Weight
Reduction.
The low density of PHENOSET® microspheres
helps to reduce the weight of the finished product.
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- Machinability
and Sandability.
PHENOSET® microspheres have excellent compatibility
with resins. When used in syntactic foams, PHENOSET®
microspheres make it easy to machine with clean and precise
edge cuts.
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- Superior
compatability with resins.
PHENOSET® microspheres can form excellent
chemical bonds with organic base resins such as epoxy,
polyester, polyurethane and others to produce a composite
with very good physical properties. No coupling agents
are required to achieve bonding of the PHENOSET®
microspheres and resin matrix.
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- Improved
Surface Properties.
The inherent bonding of the spheres with the base
resin prevents the filler from scarring or popping from
the surface of the composite. Hence, PHENOSET®
microspheres can contribute to the outstanding smoothness
of composites.
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- Strength
to Density Ratio.
PHENOSET® microspheres, although lightweight,
have comparatively high mechanical strength.
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- Improved
Flowabilitiy.
PHENOSET®
microspheres, being spherical, roll easily over one another.
This helps improve the flowability of the matrix to which
they are added.
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- Low
Viscosity for High Loading.
The spherical shape of PHENOSET® microspheres
gives lower resin viscosity when compared to equivalent
loading of other irregular-shaped fillers.
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- Good
FST properties
PHENOSET®
microspheres can char without emission of toxic fumes
and with low emission of smoke. Used in aerospace applications,
the PHENOSET® microspheres can contribute
good FST properties as required.
- Ablative property
PHENOSET®
microspheres,
being phenolic and hollow in nature, acts as a sacrificial media to
protect and insulate structures subjected to extreme thermal
environment. They absorb heat, burn off without smoke and remove heat
from the structure.
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